TSMC - UAiTED 2023 International Internship Program

Description

TSMC DNA Internship Program (Develop, Navigate, and Advance Offer) is an exciting, challenging, and engaging internship program for young graduates all over the world.
This program provides an opportunity for students to:

- Develop: Partake a series of advanced, well-designed lectures

- Navigate: Join exciting hands-on projects with our world-class experts

- Advance Offer: Earn the opportunity for an Advance Offer through exceptional performance

TSMC DNA Internship Program aims to establish early engagement with top/selected students at major universities for advance offer and future potential hiring. This internship program would like to strengthen our interns' understanding of the company and give them the chance to navigate their career possibilities and experience the role that they are interested in.

UAiTED will arrange a mentor from a local host university.

Award

TSMC will provide overseas interns with:

• Intern Visa
• Round-trip flight tickets
• Accommodation
• Intern Salary
• Employment Insurance
  

This is a paid internship program. Recruiters will further discuss the salary package with qualified applicants.

Partnering Institutions and Organization

Host Organization: Taiwan Semiconductor Manufacturing Company, Ltd.

https://www.tsmc.com/english/default.htm

Host Universities:
National Cheng Kung University https://www.ncku.edu.tw/index.php?Lang=en

National Tsing Hua University https://nthu-en.site.nthu.edu.tw/

National Yang Ming Chiao Tung University https://en.nycu.edu.tw/

Host universities will provide interns with mentors

Length of Internship

2-3 months (min. 6 weeks)

Working days: min. 4 days/w (Prior agreement and put in salary proposal)

The internship commencement date will be based on the discussion and agreement between recruiters and applicants.

Internship Location

Taiwan

Eligibility Requirements

• Master first year, or Ph.D., or senior undergraduate who are admitted to master’s program in the 2023 fall.
• Mandarin Proficiency: Intermediate to fluent
• Major: EE, Material Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, CS and related fields in engineering

How To Apply

1. Deadline

• 2022/12/31 (will keep rolling till 2023)

2. Application materials

• Resume
• Official transcript (with complete academic record)
• Proof of English and Chinese Proficiency (Eg. Language Proficiency Certificate / High School Exam Result Slip)

3. Submission

• Submit to: uaited2019@gmail.com
• Address to: UAiTED Secretariat
• Email subject: Name_University Name_2023 TSMC Internship Program

 Terms and Conditions

1. Application open to UAiTED member universities students